ReviewPolymers2025
High-Thermal-Conductivity Graphene/Epoxy Resin Composites: A Review of Reinforcement Mechanisms, Structural Regulation and Application Challenges.
Review in Polymers, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 4 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
4 citing papers in PubMed.
- Finite Element Modeling of the Thermal Conductivity of Polymer Composites Reinforced with Graphite Sheets.Polymers · 2026Article
- A Review on the Research Progress of Imprint Film Materials for Nanoimprint Lithography.Micromachines · 2026Review
- Synergetic properties of advanced materials for high-power and high-temperature applications.Discover nano · 2026Review
- Study on Graphene-Reinforced Epoxy Solvent-Borne High-Temperature-Resistant Adhesives for Bonding C/C Composites Under Extreme Temperatures.Materials (Basel, Switzerland) · 2025Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
4 authors.
Funding
Abstract
As electronic devices advance toward higher power density, heat dissipation has emerged as a critical bottleneck limiting their reliability. Graphene oxide (GO)/epoxy resin (EP) composites, combining high-thermal-conductivity potential with polymer-matrix advantages, have become a key focus for overcoming the limitations of traditional metal heat-dissipation materials. This review systematically examines these composites, analyzing their thermal conductivity enhancement mechanisms, structural regulation strategies, and application challenges. We first elaborate on how GO's intrinsic properties influence its enhancement capability, then explore the roles of physical dispersion strategies and interfacial modification techniques in optimizing filler dispersion and reducing interfacial thermal resistance, revealing the effects of preparation processes on thermal conduction network construction. Their remarkable potential is demonstrated in applications such as electronic packaging and electromagnetic shielding. However, challenges including cross-scale structural design and multi-physics collaborative regulation remain. This review aims to provide theoretical foundations and technical guidance for transitioning these composites from lab research to industrial application and advancing thermal management in high-performance electronics.
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What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.