ArticleScientific reports2025
Experimentally validated finite element model for mechanical and fracture characteristics of SiCN thin films under different loads.
Article in Scientific reports, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
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Abstract
In this work, SiCN thin films were deposited on p-Si (100) substrate using a thermal Chemical Vapor Deposition (CVD) process. The mechanical behavior of the thin film was characterized using the nanoindentation technique, where the load was varied from 1 to 4 mN, to understand the influence of load variation on the load-displacement response. Additionally, an experimentally validated FE model, incorporating an elast-plastic material response of the thin film, was developed to understand localized stress distribution and fracture behavior. The fracture behavior is examined through two modes: (a) cracking and interfacial delamination during the nano-indentation test and (b) the peel test. The FE model revealed that in the case of the weak cohesive interface between SiCN and Si, the interfacial failure initiates at a critical displacement of ∼ 110 nm. During the peel test, it was observed that the critical fracture energy of the interface plays a significant role in the interface debonding. These finding highlights the strong dependence of the mechanical integrity of the SiCN thin film on the applied load.
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