Evidence map›Paper›PMID 40874433›Full record

ReviewAdvanced science (Weinheim, Baden-Wurttemberg, Germany)2025

A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to Applications.

Wang Qin, Shujuan Li, Wei Wei, Haiqing Bai, Shikui Jia, Robert G Landers, Yunlong Ma, Sha Wei, Tuo Kang, Miao Zhang and 3 more

Abstract readReview
PubMed Full text at PMC Publisher
In one paragraph

Review in Advanced science (Weinheim, Baden-Wurttemberg, Germany), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.

0numbers the graph read from it
0cells of the map it votes in
2citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

2 citing papers in PubMed.

  1. Article
  2. A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to Applications.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2025
    Review
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

13 authors.

Wang QinSchool of Mechanical and Precision Instrument Engineering, Xi'an University of Technology, Xi'an, Shaanxi, 710000, China.ORCID https://orcid.org/0000-0002-5586-1727
Shujuan LiSchool of Mechanical and Precision Instrument Engineering, Xi'an University of Technology, Xi'an, Shaanxi, 710000, China.ORCID https://orcid.org/0000-0001-9703-8379
Wei WeiSchool of Mechanical and Precision Instrument Engineering, Xi'an University of Technology, Xi'an, Shaanxi, 710000, China.
Haiqing BaiSchool of Mechanical Engineering, Shaanxi University of Technology, Hanzhong, Shaanxi, 723001, China.
Shikui JiaShaanxi Key Laboratory of Industrial Automation, Hanzhong, Shaanxi, 723001, China.
Robert G LandersAerospace and Mechanical Engineering Department, University of Notre Dame, Notre Dame, IN, 46556, USA.
Yunlong MaSchool of Mechanical and Precision Instrument Engineering, Xi'an University of Technology, Xi'an, Shaanxi, 710000, China.
Sha WeiSchool of Mechanical and Precision Instrument Engineering, Xi'an University of Technology, Xi'an, Shaanxi, 710000, China.
Tuo KangSchool of Mechanical and Precision Instrument Engineering, Xi'an University of Technology, Xi'an, Shaanxi, 710000, China.
Miao ZhangSchool of Mechanical and Precision Instrument Engineering, Xi'an University of Technology, Xi'an, Shaanxi, 710000, China.
Weipei ZhangSchool of Mechanical and Precision Instrument Engineering, Xi'an University of Technology, Xi'an, Shaanxi, 710000, China.
Mingkun WangSchool of Mechanical and Precision Instrument Engineering, Xi'an University of Technology, Xi'an, Shaanxi, 710000, China.
Tongxin GuanSchool of Mechanical and Precision Instrument Engineering, Xi'an University of Technology, Xi'an, Shaanxi, 710000, China.

Funding

Key Project of Shaanxi Provincial Department of Education 13JS071Key Research and Development Project of Shaanxi Province 2021GY-275National Natural Science Foundation of China 51575442
6 · The paper itself

Abstract

With the continuous development of digital surface circuit manufacturing technology, the three-dimensional (3D) printing strategy of structural electronics has shown an increasingly wide application prospect in the field of electronics, especially in its main subfields such as conformal antennas, sensors, and aerospace. However, there are still many technical challenges in manufacturing high-precision circuits on complex curved surfaces and within structures. In view of that, this study summarizes the latest development trends and results in 3D printing technology for structural electronics, focusing on the materials, conformal manufacturing technology, printing process control strategies, and their practical applications. In addition, this study analyzes the characteristics, advantages, and limitations of different digital surface circuit manufacturing processes and discusses their application potentials in practice. Finally, this study presents possible future development directions in the field of structural electronics 3D printing and emphasizes the opportunities and challenges in manufacturing conformal electronics on arbitrary surfaces.

Indexed as

3D printingcurved surface circuitform following manufacturingprinted circuitstructural electronics

Identifiers

PMID40874433
PMCPMC12462998

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.