ArticleMicromachines2025
A Novel Polysilicon-Fill-Strengthened Etch-Through 3D Trench Electrode Detector: Fabrication Methods and Electrical Property Simulations.
Article in Micromachines, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
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1 citing paper in PubMed.
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8 authors.
Funding
Abstract
Three-dimensional trench electrode silicon detectors play an important role in particle physics research, nuclear radiation detection, and other fields. A novel polysilicon-fill-strengthened etch-through 3D trench electrode detector is proposed to address the shortcomings of traditional 3D trench electrode silicon detectors; for example, the distribution of non-uniform electric fields, asymmetric electric potential, and dead zone. The physical properties of the detector have been extensively and systematically studied. This study simulated the electric field, potential, electron concentration distribution, complete depletion voltage, leakage current, capacitance, transient current induced by incident particles, and weighting field distribution of the detector. It also systematically studied and analyzed the electrical characteristics of the detector. Compared to traditional 3D trench electrode silicon detectors, this new detector adopts a manufacturing process of double-side etching technology and double-side filling technology, which results in a more sensitive detector volume and higher electric field uniformity. In addition, the size of the detector unit is 120 µm × 120 µm × 340 µm; the structure has a small fully depleted voltage, reaching a fully depleted state at around 1.4 V, with a saturation leakage current of approximately 4.8×10-10A, and a geometric capacitance of about 99 fF.
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