Evidence map›Paper›PMID 40872346›Full record

ReviewMicromachines2025

AI-Powered Next-Generation Technology for Semiconductor Optical Metrology: A Review.

Weiwang Xu, Houdao Zhang, Lingjing Ji, Zhongyu Li

Abstract readReview
In one paragraph

Review in Micromachines, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Multi-Task Deep Learning for Surface Metrology.Sensors (Basel, Switzerland) · 2025
    Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

4 authors.

Weiwang XuShanghai Precision Measurement Semiconductor Technology, Inc., Shanghai 210700, China.
Houdao ZhangShanghai Precision Measurement Semiconductor Technology, Inc., Shanghai 210700, China.
Lingjing JiShanghai Precision Measurement Semiconductor Technology, Inc., Shanghai 210700, China.
Zhongyu LiShanghai Precision Measurement Semiconductor Technology, Inc., Shanghai 210700, China.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

As semiconductor manufacturing advances into the angstrom-scale era characterized by three-dimensional integration, conventional metrology technologies face fundamental limitations regarding accuracy, speed, and non-destructiveness. Although optical spectroscopy has emerged as a prominent research focus, its application in complex manufacturing scenarios continues to confront significant technical barriers. This review establishes three concrete objectives: To categorize AI-optical spectroscopy integration paradigms spanning forward surrogate modeling, inverse prediction, physics-informed neural networks (PINNs), and multi-level architectures; to benchmark their efficacy against critical industrial metrology challenges including tool-to-tool (T2T) matching and high-aspect-ratio (HAR) structure characterization; and to identify unresolved bottlenecks for guiding next-generation intelligent semiconductor metrology. By categorically elaborating on the innovative applications of AI algorithms-such as forward surrogate models, inverse modeling techniques, physics-informed neural networks (PINNs), and multi-level network architectures-in optical spectroscopy, this work methodically assesses the implementation efficacy and limitations of each technical pathway. Through actual application case studies involving J-profiler software 5.0 and associated algorithms, this review validates the significant efficacy of AI technologies in addressing critical industrial challenges, including tool-to-tool (T2T) matching. The research demonstrates that the fusion of AI and optical spectroscopy delivers technological breakthroughs for semiconductor metrology; however, persistent challenges remain concerning data veracity, insufficient datasets, and cross-scale compatibility. Future research should prioritize enhancing model generalization capability, optimizing data acquisition and utilization strategies, and balancing algorithm real-time performance with accuracy, thereby catalyzing the transformation of semiconductor manufacturing towards an intelligence-driven advanced metrology paradigm.

Indexed as

Artificial Intelligence (AI)Mueller Matrix Ellipsometry (MME)multi-task learningoptical spectroscopyphysics-informed neural network (PINN)tool-to-tool (T2T) matching

Identifiers

PMID40872346
PMCPMC12388819

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.