Evidence map›Paper›PMID 40870242›Full record

ArticleMaterials (Basel, Switzerland)2025

In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy.

Kazuhiro Nogita, Xin Fu Tan, Jiye Zhou, Stuart D McDonald, Keith Sweatman, Flora Somidin, Guang Zeng, Hiroshi Maeno, Kazuhiro Yasuda, Christopher M Gourlay

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Materials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

10 authors.

Kazuhiro NogitaNihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia.ORCID 0000-0002-0721-6600
Xin Fu TanNihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia.ORCID 0000-0001-8061-2629
Jiye ZhouNihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia.
Stuart D McDonaldNihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia.ORCID 0000-0001-7039-8921
Keith SweatmanNihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia.ORCID 0000-0002-2954-5587
Flora SomidinElectronic Packaging & Thin Film Materials Research Group, Centre of Excellence Geopolymer and Green Technology (CEGeoGTech), Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, Jejawi, Arau 02600, Perlis, Malaysia.
Guang ZengSchool of Materials Science and Engineering, Central South University, Changsha 410083, China.ORCID 0000-0002-5201-9796
Hiroshi MaenoThe Ultramicroscopy Research Center, Kyushu University, Fukuoka 819-0395, Japan.
Kazuhiro YasudaThe Ultramicroscopy Research Center, Kyushu University, Fukuoka 819-0395, Japan.
Christopher M GourlayDepartment of Materials, Imperial College London, London SW7 2AZ, UK.ORCID 0000-0002-4588-6007

Funding

Australian Research Council DP200101949Nihon Superior - the University of Queensland (UQ) collaborative grants 2021002341, 2024003478The Advanced Research Infrastructure for Materials and Nanotechnology in Japan (ARIM) of the Ministry of Education, Culture, Sports, Science and Technology (MEXT) JPMXP1224KU0032The University of Queensland-Kyushu University (UQ-KU) Oceania project n/a
6 · The paper itself

Abstract

For reliable electronics, it is important to have an understanding of solder joint failure mechanisms. However, because of difficulties in real-time atomistic scale analysis during deformation, we still do not fully understand these mechanisms. Here, we report on the development of an innovative in situ method of observing the response of the microstructure to tensile strain at room temperature using high-voltage transmission electron microscopy (HV-TEM). This technique was used to observe events including dislocation formation and movement, grain boundary formation and separation, and crack initiation and propagation in a Sn-3 wt.%Ag-0.5 wt.%Cu (SAC305) alloy joint formed between copper substrates.

Indexed as

electronics packaginghigh-voltage transmission electron microscopyin situ deformationPb-free solder

Identifiers

PMID40870242
PMCPMC12387378

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Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.