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ArticleMaterials (Basel, Switzerland)2025

Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish.

Lohgaindran Jeyeselan et al.PubMed ↗Full text ↗Publisher ↗

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Full record →Abstract, authors, funding and every citing paper · PMID 40870040