Evidence map›Paper›PMID 40847129›Full record

ArticleScientific reports2025

Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu.

Yun-Fong Lee, Chih-Wen Chiu, Chin-Yen Chiu, Yu-Chen Huang, Mei-Hsin Lo, Liu-Hsin-Chen Yang, Ting-Yi Cheng, Zhong-Yen Yu, Chih-En Hsu, Kai-Chi Lin and 9 more

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Article in Scientific reports, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

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1 · What the graph read from it

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2 · The registry

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3 · Its place in the literature

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4 · The record

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5 · Who and what money

Authors and funding

19 authors.

Yun-Fong LeeDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Chih-Wen ChiuDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Chin-Yen ChiuDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Yu-Chen HuangDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Mei-Hsin LoDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Liu-Hsin-Chen YangDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Ting-Yi ChengDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Zhong-Yen YuDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Chih-En HsuDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Kai-Chi LinDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Po-Yu ChenDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Wei-Cheih HuangDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Jui-Sheng ChangDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Shao-An PanDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Yi-Cheng SuDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Chin-Li LinDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Hang-Chen HsiehDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Chia-Hua LinDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC.
Cheng-Yi LiuDepartment of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Rd., Zhongli District, Taoyuan City, 32001, Taiwan, ROC. chengyiliuoem@gmail.com.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Cu-Cu direct bonding using electroplated ultrafine-grain Cu (107.24 nm) was studied in air at 110-150 °C. Unstable grain boundaries enabled ultrafast grain growth across the bonding interface, analyzed via coincidence site lattice (CSL) boundaries using EBSD. Above 125 °C, the Σ3 boundary length exceeded 40%, while below 120 °C it rapidly declined, transforming into Σ27a, indicating a critical transition dominated by the {115} plane. A temperature-time-dependent grain growth model was developed, incorporating CSL effects. Simulations showed grain evolution and timing of CSL boundary formation, with transition times from 316 to 190 s as temperature increased.

Identifiers

PMID40847129
PMCPMC12373834

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.