ArticleAdvanced materials (Deerfield Beach, Fla.)2025
Unlocking the Essence of Lignin: High-Performance Adhesives That Bond via Thiol-Catechol Connectivities and Debond on Electrochemical Command.
Article in Advanced materials (Deerfield Beach, Fla.), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 3 papers.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
3 citing papers in PubMed.
- Conformation-Modulated Lignin for Durable and High-Output Cellulosic Triboelectric Materials Toward Self-Powered Sensing.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026Article
- Strength from Within: Reversible Reinforcement of Paper through In-Sheet Formation of Thiol-Catechol Polymers.ACS applied materials & interfaces · 2025Article
- Unlocking the Essence of Lignin: High-Performance Adhesives That Bond via Thiol-Catechol Connectivities and Debond on Electrochemical Command.Advanced materials (Deerfield Beach, Fla.) · 2025Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
8 authors.
Funding
Abstract
The next generation of adhesives requires effective debonding capabilities that can be triggered on demand to enable advanced circular repair and recycling strategies. A new class of lignin-inspired, two-component (2K) structural adhesives offers bonding strengths of up to 20 MPa and clean, on-command electrochemical debonding within 5-30 min. The debonding is induced by a distinct electrochemical oxidation of thiol-catechol connectivities (TCCs) within the entire adhesive network, enforcing rapid and clean adhesive failure on the cathodic substrate side. The TCC-functionalities are formed during curing by a thiol-quinone Michael-type polyaddition, reacting polyester-based trithiols with tris-quinones as lignin-inspired minimal building blocks. The structural adhesive can be fine-tuned by adjusting the formulation. The addition of carbon black and ionic liquids facilitates the desired electrochemical transformation of TCC-catechols to TCC-quinones. Applying only 9 V for 5-30 min, leads to clean debonding with 72-86% loss of shear strength. A comprehensive study of curing, bonding, and debonding behavior by rheological, spectroscopic, and electrochemical investigations reveals the debonding mechanism by correlating catechol oxidation to adhesive performance. The electrochemical debonding capability of TCC-structural adhesives is demonstrated in a functional prototype, where on-command detachment of a cover glass from a display device is achieved within 6.5 min.
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.