The Influence of h-BN Distribution Behavior on the Electrothermal Properties of Bismaleimide Resin.

Weizhuo Li, Xuan Wang, Mingzhe Qu, Xiaoming Wang, Jiahao Shi

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Article in Polymers, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

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5 · Who and what money

Authors and funding

5 authors.

Weizhuo LiSchool of Intelligence and Civil Engineering, Harbin University, Harbin 150076, China.

Xuan WangKey Laboratory of Engineering Dielectrics and Application, Ministry of Education, Harbin University of Science and Technology, Harbin 150080, China.

Mingzhe QuSchool of Intelligence and Civil Engineering, Harbin University, Harbin 150076, China.

Xiaoming WangSchool of Material Science and Chemical Engineering, Harbin University of Science and Technology, Harbin 150080, China.

Jiahao ShiKey Laboratory of Engineering Dielectrics and Application, Ministry of Education, Harbin University of Science and Technology, Harbin 150080, China.

Funding

Digital Transformation Teaching Reform in Application-Oriented Undergraduate Universities under the Background of Emerging Engineering Education GJB1424219The General Research Project on Higher Education Teaching Reform in 2022 SJGY20220509

6 · The paper itself

Abstract

Thermal conductive composite materials have excellent electrical insulation properties, low cost, and are lightweight, making them a promising alternative to traditional electronic packaging materials and enhancing the heat dissipation of integrated circuits. Due to the differences in specific surface area and volume, thermal conductive fillers have poor interface connections between the polymer and/or thermal conductive filler, thereby increasing phonon scattering and affecting thermal conductivity. This article uses bismaleimide resin as the matrix and h-BN as the thermal conductive filler. The evolution laws of thermal conductivity and dielectric properties of thermal conductive composite materials were systematically characterized through multi-scale filler control and gradient filling design. Among them, h-BN with a diameter of 10 μm has the most significant improvement in thermal conductivity. When the filling amount is 40 wt%, the thermal conductivity reaches 1.31 W/(m·K).

Indexed as

bismaleimideh-BNthermal conductivityY. Agari model

Identifiers

PMID40732810

DOI10.3390/polym17141929

PMCPMC12299978

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