Radiative Heat Transfer Properties of Fiber-Aerogel Composites for Thermal Insulation.

Fiber-aerogel composites have gained significant attention as high-performance thermal insulation materials due to their unique microstructure, which suppresses conductive, convective, and radiative heat transfer. At room temperature, silica aerogels in particular exhibit ultralow thermal conductivity (<0.02 W/m·K), which is two to three times lower than that of still air (0.026 W/m·K). Their brittle skeleton and high infrared transparency, however, restrict how well they insulate, particularly at high temperatures (>300 °C). Incorporating microscale fibers into the aerogel matrix enhances mechanical strength and reduces radiative heat transfer by increasing scattering and absorption. For instance, it has been demonstrated that adding glass fibers reduces radiative heat transmission by around 40% because of increased infrared scattering. This review explores the fundamental mechanisms governing radiative heat transfer in fiber-aerogel composites, emphasizing absorption, scattering, and extinction coefficients. We discuss recent advancements in fiber-reinforced aerogels, focusing on material selection, structural modifications, and predictive heat transfer models. Recent studies indicate that incorporating fiber volume fractions as low as 10% can reduce the thermal conductivity of composites by up to 30%, without compromising their mechanical integrity. Key analytical and experimental methods for determining radiative properties, including Fourier transform infrared (FTIR) spectroscopy and numerical modeling approaches, are examined. The emissivity and transmittance of fiber-aerogel composites have been successfully measured using FTIR spectroscopy; tests show that fiber reinforcement at high temperatures reduces emissivity by about 15%. We conclude by outlining the present issues and potential avenues for future research to optimize fiber-aerogel composites for high-temperature applications, including energy-efficient buildings (where long-term thermal stability is necessary), electronics thermal management systems, and aerospace (where temperatures may surpass 1000 °C), with a focus on improving the materials' affordability and scalability for industrial applications.