Evidence map›Paper›PMID 40593616›Full record

ArticleNature communications2025

Sacrifice-layer-free transfer of wafer-scale atomic-layer-deposited dielectrics and full-device stacks for two-dimensional electronics.

Yuyu He, Zunxian Lv, Zhaochao Liu, Mingjian Yang, Wei Ai, Jiabiao Chen, Wanying Chen, Bing Wang, Xuewen Fu, Feng Luo and 1 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Nature communications, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 5 papers.

0numbers the graph read from it
0cells of the map it votes in
5citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

5 citing papers in PubMed.

  1. Review
  2. Article
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4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

11 authors.

Yuyu HeTianjin Key Lab for Rare Earth Materials and Applications, Center for Rare Earth and Inorganic Functional Materials, School of Materials Science and Engineering, Nankai University, Tianjin, China.ORCID http://orcid.org/0009-0004-6024-1612
Zunxian LvTianjin Key Lab for Rare Earth Materials and Applications, Center for Rare Earth and Inorganic Functional Materials, School of Materials Science and Engineering, Nankai University, Tianjin, China.
Zhaochao LiuTianjin Key Lab for Rare Earth Materials and Applications, Center for Rare Earth and Inorganic Functional Materials, School of Materials Science and Engineering, Nankai University, Tianjin, China.
Mingjian YangTianjin Key Lab for Rare Earth Materials and Applications, Center for Rare Earth and Inorganic Functional Materials, School of Materials Science and Engineering, Nankai University, Tianjin, China.
Wei AiTianjin Key Lab for Rare Earth Materials and Applications, Center for Rare Earth and Inorganic Functional Materials, School of Materials Science and Engineering, Nankai University, Tianjin, China.
Jiabiao ChenTianjin Key Lab for Rare Earth Materials and Applications, Center for Rare Earth and Inorganic Functional Materials, School of Materials Science and Engineering, Nankai University, Tianjin, China.ORCID http://orcid.org/0000-0002-8536-6575
Wanying ChenTianjin Key Lab for Rare Earth Materials and Applications, Center for Rare Earth and Inorganic Functional Materials, School of Materials Science and Engineering, Nankai University, Tianjin, China.
Bing WangTianjin Key Lab for Rare Earth Materials and Applications, Center for Rare Earth and Inorganic Functional Materials, School of Materials Science and Engineering, Nankai University, Tianjin, China.
Xuewen FuUltrafast Electron Microscopy Laboratory, The MOE Key Laboratory of Weak-Light Nonlinear Photonics, School of Physics, Nankai University, Tianjin, China.ORCID http://orcid.org/0000-0001-6116-4680
Feng LuoTianjin Key Lab for Rare Earth Materials and Applications, Center for Rare Earth and Inorganic Functional Materials, School of Materials Science and Engineering, Nankai University, Tianjin, China.ORCID http://orcid.org/0000-0003-3442-3987
Jinxiong WuTianjin Key Lab for Rare Earth Materials and Applications, Center for Rare Earth and Inorganic Functional Materials, School of Materials Science and Engineering, Nankai University, Tianjin, China. jxwu@nankai.edu.cn.ORCID http://orcid.org/0000-0002-0286-1213

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Transfer printing techniques have enabled the fabrication of devices on soft or delicate substrates that are incompatible with conventional manufacturing processes. However, the involved sacrifice-layer removal process typically causes damage to the quality of device interfaces. Here, we develop a sacrifice-layer-free transfer printing strategy by pre-depositing the device constituents onto commercially available mica substrates. The intrinsic weak interfacial interaction enables the transfer of various pre-deposited device constituents at the wafer scale, including well-known strongly adhesive dielectrics grown by atomic layer deposition (ALD). Moreover, entire top-gated device stacks can be simultaneously transferred onto few-layer MoS

Identifiers

PMID40593616
PMCPMC12217795

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.