ArticleMaterials (Basel, Switzerland)2025
Interfacial Behavior During Reactions Between Sn and Electroplated Co-Zn Alloys.
Article in Materials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
This study investigates the electroplating characteristics of Co-Zn alloy coatings with varying Zn contents (0.55 wt.%~8.8 wt.%) and their influence on intermetallic compound (IMC) formation during reactions with Sn solder. Co-Zn alloy coatings were successfully fabricated by electroplating using cobalt plating solutions with different concentrations of zinc sulfate. The results reveal anomalous co-deposition behavior, where the less noble Zn preferentially deposits over Co. Surface morphologies and microstructures evolve significantly with increasing Zn content, transitioning from columnar to dendritic structures. Zn incorporation into the Co lattice disrupts its crystallinity, leading to decreased crystallinity and partial amorphization. Liquid-state and solid-state interfacial reactions with Sn solder demonstrate that Zn content considerably influences IMC formation. In liquid-state reactions at 250 °C, lower Zn contents (0.55-4.8 wt.%) slightly enhance CoSn
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