ArticleMicromachines2025
Study on the Motion Trajectory of Abrasives and Surface Improvement Mechanism in Ultrasonic-Assisted Diamond Wire Sawing Monocrystalline Silicon.
Article in Micromachines, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.
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Who cites it
2 citing papers in PubMed.
- Experimental Study on Slicing Sapphire Crystal with Ultrasonic-Assisted Diamond Wire Saw.Micromachines · 2026Article
- Simulation and Experimental Study of Multi-Grain Diamond Cutting of Monocrystalline Silicon.Micromachines · 2026Article
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Authors and funding
4 authors.
Funding
Abstract
The surface quality of diamond wire sawing (DWS) wafers directly affects the efficiency and yield of subsequent processing steps. This paper investigates the motion trajectory of abrasives in ultrasonic-assisted diamond wire sawing (UADWS) and its mechanism for improving surface quality. The influence of ultrasonic vibration on the cutting arc length, cutting depth, and interference of multi-abrasive trajectories was analyzed through the establishment of an abrasive motion trajectory model. The ultrasonic vibration transforms the abrasive trajectory from linear to sinusoidal, thereby increasing the cutting arc length while reducing the cutting depth. A lower wire speed was found to be more conducive to exploiting the advantages of ultrasonic vibration. Furthermore, the intersecting interference of multi-abrasive trajectories contributes to enhanced surface quality. Experimental studies were conducted on monocrystalline silicon (mono-Si) to verify the effectiveness of ultrasonic vibration in improving surface morphology and reducing wire marks during the sawing process. The experimental results demonstrate that, compared with DWS, UADWS achieves a significantly lower surface roughness
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