ArticleMicromachines2025
Validation of Experimental Cooling Performance of Multi-Stage Thin-Film Thermoelectric Devices via Numerical Simulation.
Article in Micromachines, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Who cites it
1 citing paper in PubMed.
- Thermoelectric Materials and Devices.Micromachines · 2026Article
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9 authors.
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No grant is acknowledged in the PubMed record.
Abstract
In-plane thermoelectric thin-film cooling devices are considered a promising solution for thermal management in electronic systems. However, the actual cooling performance is far below that of regular bulk cooling devices, making the design of thin-film devices much more difficult. In this work, a numerical analysis of the cooling performance of single-leg thin-film devices and multi-stage cascaded thin-film devices was conducted to understand the depressed cooling performance. The effects of input current, operating environment, substrate, and contact resistance on cooling performance were investigated and compared with the experimental data. The results show that under ideal conditions, including vacuum environment, absence of substrate, and no contact resistance, the maximum cooling temperature difference simulated by the finite element method (105.4 K) closely matches the theoretical value estimated from the
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