Evidence map›Paper›PMID 40559291›Full record

ArticleNanomaterials (Basel, Switzerland)2025

Study on Regulation Mechanism of Heat Transport at Aluminum Nitride/Graphene/Silicon Carbide Heterogeneous Interface.

Dongjing Liu, Pengbo Wang, Zhiliang Hu, Jia Fu, Wei Qin, Jianbin Yu, Yangyang Zhang, Bing Yang, Yunqing Tang

Abstract read
In one paragraph

Article in Nanomaterials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.

0numbers the graph read from it
0cells of the map it votes in
2citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

2 citing papers in PubMed.

  1. Article
  2. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

9 authors.

Dongjing LiuGuangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China.
Pengbo WangGuangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China.
Zhiliang HuGuangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China.
Jia FuSchool of Mechanical Engineering, Shandong University, Jinan 250061, China.
Wei QinSDEE Contemporary Energy Technology Co., Ltd., Jinan 250061, China.
Jianbin YuSDEE Contemporary Energy Technology Co., Ltd., Jinan 250061, China.
Yangyang ZhangSDEE Contemporary Energy Technology Co., Ltd., Jinan 250061, China.
Bing YangCentre for Advanced Laser Manufacturing (CALM), School of Mechanical Engineering, Shandong University of Technology, Zibo 255000, China.
Yunqing TangGuangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China.ORCID 0000-0003-1836-8674

Funding

2024 Project on Enhancement of Basic Research Ability for Young and Middle-aged Teachers in Guangxi Universities, China 2024KY0203China Postdoctoral Science Foundation 2024M751863Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology 19-050-44-002ZGuangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology 24354S012Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology GUIKEAD 25069080Guangxi Science and Technology Program GUIKEAB24010102Nanning scientific research and technology development plan major science and technology project 20241026Shandong Excellent Young Scientists Fund Program (Overseas) 2024HWYQ-003Shandong Provincial Natural Science Foundation ZR2022QE045Young Taishan Scholars Program of Shandong Province tsqn202306087
6 · The paper itself

Abstract

In order to solve the self-heating problem of power electronic devices, this paper adopts a nonequilibrium molecular dynamics approach to study the thermal transport regulation mechanism of the aluminum nitride/graphene/silicon carbide heterogeneous interface. The effects of temperature, size, and vacancy defects on interfacial thermal conductivity are analyzed by phonon state density versus phonon participation rate to reveal their phonon transfer mechanisms during thermal transport. It is shown that the interfacial thermal conductance (ITC) increases about three times when the temperature increases from 300 K to 1100 K. It is analyzed that the increase in temperature will enhance lattice vibration, enhance phonon coupling degree, and thus increase its ITC. With the increase in the number of AlN-SiC layers from 8 to 28, the ITC increases by about 295.3%, and it is analyzed that the increase in the number of AlN-SiC layers effectively reduces the interfacial scattering and improves the phonon interfacial transmission efficiency. The increase in the number of graphene layers from 1 layer to 4 layers decreases the ITC by 70.3%. The interfacial thermal conductivity reaches a minimum, which is attributed to the increase in graphene layers aggravating the degree of phonon localization. Under the influence of the increase in graphene single and double vacancy defects concentration, the ITC is slightly reduced. When the defect rate reaches about 20%, the interfacial thermal conductance of SV (single vacancy) and DV (double vacancy) defects rises back to 5.606 × 10

Indexed as

interfacial thermal conductivityphonon density of statessize effectstemperature effectsvacancy defects

Identifiers

PMID40559291
PMCPMC12196259

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.