Evidence map›Paper›PMID 40508751›Full record

ArticlePolymers2025

Preparation of Phenolic Epoxy-Based Electronic Packaging Materials with High Thermal Conductivity by Creating an Interfacial Heat Conduction Network.

Minghao Ye, Jing Jiang, Lin Zhao, Hongyu Zhu, Junjie Wang, Zicai Sun, Dewei Zhang, Ming Li, Yagang Zhang

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Polymers, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

9 authors.

Minghao YeSchool of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, China.
Jing JiangSchool of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, China.
Lin ZhaoSchool of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, China.
Hongyu ZhuSchool of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, China.
Junjie WangDepartment of Chemistry, School of Science, Xihua University, Chengdu 610039, China.
Zicai SunDongguan Yimei Material Technology Co., Ltd., Dongguan 523000, China.
Dewei ZhangSichuan Xinyi Electronic Materials Co., Ltd., Chengdu 611731, China.
Ming LiSichuan Xinyi Electronic Materials Co., Ltd., Chengdu 611731, China.
Yagang ZhangSchool of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, China.ORCID 0000-0001-9457-1450

Funding

National Natural Science Foundation of China 21464015, 21472235"Tianfu Emei" Science and Technology Innovation Leader Program in Sichuan Province 2021University of Electronic Science and Technology of China Talent Start-up Funds A1098 5310 2360 1208
6 · The paper itself

Abstract

As one of the most widely used packaging materials, epoxy composite (EP) offers excellent insulation properties; however, its intrinsic low thermal conductivity (TC) limits its application in high-frequency and high-power devices. To enhance the TC of EP, six highly thermally conductive inorganic fillers, namely, Al

Indexed as

electronic packaging materialsepoxy molding compoundshigh thermal conductivityinterfacial conduction networks

Identifiers

PMID40508751
PMCPMC12158111

What OpenQuestion holds

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Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.