Soluble Photosensitive Polyimide Precursor with Bisphenol A Framework: Synthesis and Characterization.

Bowen Zheng, Jing Li, Ning Li, Wa Li, Shuai Zhang, Haile Lei

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Article in Polymers, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

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5 · Who and what money

Authors and funding

6 authors.

Bowen ZhengResearch Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China.

Jing LiResearch Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China.

Ning LiResearch Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China.

Wa LiResearch Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China.

Shuai ZhangResearch Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China.ORCID 0000-0003-3718-8003

Haile LeiResearch Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China.

Funding

Innovation and Development Foundation of China Academy of Engineering Physics CX20210039Natural Science Foundation of Sichuan 2023NSFSC0309

6 · The paper itself

Abstract

A soluble photosensitive polyamide ester precursor (BAFPAE) was synthesized through copolymerization of 2,2-bis [4-(4-aminophenoxy)phenyl]hexafluoropropane (HFBAPP) with 4,4'-(4,4'-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA). Hydroxyethyl methacrylate (HEMA) was incorporated as a photosensitive functional group, and a transparent photosensitive polyimide film was obtained by thermal curing of the precursor film. The effects of reaction temperature and varying HEMA equivalents on the mechanical properties of the film were systematically investigated. The results indicated that the formation of polyacrylate-polyimide interpenetrating polymer networks (IPNs) was pivotal in preserving the mechanical integrity of the material. The optimized BAF-

Indexed as

bisphenol Amechanical propertiesphotosensitive polyimide (PSPI)polymer networks (IPNs)solubility

Identifiers

PMID40508671

DOI10.3390/polym17111428

PMCPMC12157256

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