ArticleIEEE International Conference on Nano/Micro Engineered and Molecular Systems. IEEE International Conference on Nano/Micro Engineered and Molecular Systems2020
Bending Properties of Materials for Peripheral Nerve Interfaces.
Article in IEEE International Conference on Nano/Micro Engineered and Molecular Systems. IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2020. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 4 papers.
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The trial behind it
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Who cites it
4 citing papers in PubMed.
- Design, Fabrication, and Implantation of Invasive Microelectrode Arrays as in vivo Brain Machine Interfaces: A Comprehensive Review.Journal of manufacturing processes · 2024Article
- Fabrication and Validation of Sub-Cellular Carbon Fiber Electrodes.IEEE transactions on neural systems and rehabilitation engineering : a publication of the IEEE Engineering in Medicine and Biology Society · 2024Article
- Manufacturing Processes of Implantable Microelectrode Array for In Vivo Neural Electrophysiological Recordings and Stimulation: A State-Of-the-Art Review.Journal of micro- and nano-manufacturing · 2022Article
- Sharpened and Mechanically Durable Carbon Fiber Electrode Arrays for Neural Recording.IEEE transactions on neural systems and rehabilitation engineering : a publication of the IEEE Engineering in Medicine and Biology Society · 2021Article
Corrections and comments
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Authors and funding
6 authors.
Funding
Abstract
Intrafascicular peripheral nerve interfaces (PNIs) with penetrating electrodes have the potential to chronically record from nerves on the scale of single axons. The small size and dynamic environment of peripheral nerves makes material selection important for these devices. In this work, we describe how the bending properties of common PNI electrode materials contribute to their effectiveness as self-inserting PNIs. First, tungsten, platinum-iridium, and carbon fiber wires are tested to assess their ability to survive repeated bending stresses when embedded in silicone. Next, carbon fiber wires are attached to a flexible circuit board encased in silicone to characterize how they survive stresses in prototype PNI devices. Finally, in order to validate experimental results, we use COMSOL to investigate the optimal thickness of the embedded silicone layer by simulating the stress distribution in carbon fiber wires on a flexible circuit board. Carbon fiber wires were shown to survive bending stresses better than tungsten and platinum-iridium wires. Physical testing and COMSOL modeling of carbon fiber prototype devices showed an optimal silicone thickness of 200
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Registered trials
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