ArticleNature communications2025
Directly printed standing ceramic circuit boards for rapid prototyping of miniaturization and high-power of electronics.
Article in Nature communications, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
1 citing paper in PubMed.
- Influence of Film Thickness on the Structure and Properties of Copper Thin Films Deposited on BaTiOMaterials (Basel, Switzerland) · 2025Article
Corrections and comments
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Authors and funding
13 authors.
Funding
Abstract
Ceramic circuit boards (CCBs) have been extensively utilized in 5G communications, aerospace, and artificial intelligence due to their excellent thermal conductivity and electrical performance. However, due to the limitation of manufacturing technologies, the existing CCBs can not take into account both the resolution and thickness, which restricts the miniaturization and high power of the resulting electronics. Herein, we report a standing-CCBs (S-CCBs) with both high-resolution and high aspect-ratio fabricated via sacrificial coating-assisted micro-3D printing. Benefiting from this technique, S-CCBs can be easily printed as a tall and thin-walled structure without landslides and sintered to be highly conductive wire with an overall shrinkage on the rough ceramic substrates, achieving a line width of 7 µm and aspect-ratio of 2.3 on various ceramic substrates (Al
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Registered trials
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