ArticleJournal of materials science. Materials in electronics2025
Effects of Ag and melt undercooling on the microstructure of Sn-Ag solder balls.
Article in Journal of materials science. Materials in electronics, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
The microstructure of electronic solder joints is created by solidification in an undercooled melt. Here, we apply the framework of solidification microstructure selection maps (SMSMs) to Sn-Ag solder balls with compositions from 0.5 to 5.0 wt.% Ag and bulk undercoolings in the range 10-70 K. The effects of Ag and melt undercooling on the transition from single-grain to cyclic-twinned microstructures and the extent of interlacing are revealed. Controlled by the Ag content and the competitive nucleation between the β-Sn and Ag Supplementary Information: The online version contains supplementary material available at 10.1007/s10854-025-14979-6.
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