Evidence map›Paper›PMID 40436831›Full record

ArticleNature communications2025

Self-packaged stretchable printed circuits with ligand-bound liquid metal particles in elastomer.

Hyeonyeob Seo, Gun-Hee Lee, Jiwoo Park, Dong-Yeong Kim, Yeonzu Son, Semin Kim, Kum Seok Nam, Congqi Yang, Joonhee Won, Jae-Young Bae and 5 more

Abstract read
In one paragraph

Article in Nature communications, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 10 papers.

0numbers the graph read from it
0cells of the map it votes in
10citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

10 citing papers in PubMed.

  1. Review
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4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

15 authors.

Hyeonyeob Seo *Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.ORCID http://orcid.org/0000-0002-8297-4743
Gun-Hee Lee *Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.ORCID https://orcid.org/0000-0003-4949-3355
Jiwoo ParkSchool of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.ORCID http://orcid.org/0009-0005-3966-8424
Dong-Yeong KimDepartment of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.
Yeonzu SonProgram of Brain and Cognitive Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea.ORCID http://orcid.org/0000-0002-1467-5485
Semin KimGraduate School of Semiconductor Technology, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.ORCID http://orcid.org/0009-0005-5955-2314
Kum Seok NamDepartment of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.ORCID http://orcid.org/0000-0002-4281-0875
Congqi YangMedical Research Center, Seoul National University, Seoul, Republic of Korea.
Joonhee WonDepartment of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.
Jae-Young BaeDepartment of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea.ORCID http://orcid.org/0009-0005-7049-5138
Hyunjun KimDepartment of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.ORCID http://orcid.org/0000-0001-8861-0206
Seung-Kyun KangDepartment of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea.ORCID http://orcid.org/0000-0001-9779-8976
Steve ParkDepartment of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.ORCID http://orcid.org/0000-0002-1428-592X
Jiheong KangDepartment of Chemistry, Seoul National University, Seoul, Republic of Korea. jiheongkang@snu.ac.kr.ORCID http://orcid.org/0000-0003-4446-5494
Seongjun ParkMedical Research Center, Seoul National University, Seoul, Republic of Korea. seongjunpark@snu.ac.kr.ORCID http://orcid.org/0000-0002-1981-9628

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Packaging in stretchable electronics is crucial to protect components from environmental damage while preserving mechanical flexibility and providing electrical insulation. The conventional packaging process involves multiple steps that increase in complexity as the number of circuit layers multiply. In this study, we introduce a self-packaged stretchable printed circuit board enabled by the in situ phase separation of liquid metal particles (LMPs) within various polymer matrices during solution-based printing processes. The ligand-bound LMPs (LB-LMPs), engineered to inhibit oxide growth, undergo in situ sintering, prompting vertical phase separation. This synthesis strategy not only achieves high initial conductivity of the LMPs but also encapsulates them within the polymer matrix, preventing leakage and providing electrical insulation. Our method enables multi-layer circuit printing, eliminating the need for additional activation and packaging processes. Furthermore, by integrating conductive materials into packaging layers for selective electrical conductivity, vertical interconnect accesses and conductive pads can be formed, enabling large-scale, stretchable, and leakage-free multi-layer electrical circuits and bio-interfaces.

Identifiers

PMID40436831
PMCPMC12119845

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.