ArticleAccounts of materials research2025
Advancing Thermal Management Technology for Power Semiconductors through Materials and Interface Engineering.
Article in Accounts of materials research, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 9 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
9 citing papers in PubMed.
- Thermal Anisotropy Ratio >1000 in Solution-Spun Macroscopic Carbon Nanotube Films.Nano letters · 2026Article
- Atomic Interface Engineering in Two-Dimensional Materials: A Pathway to High-Performance Flexible Thermoelectrics.Chemical record (New York, N.Y.) · 2026Review
- Fundamental limit of phonon Tesla valve for heat rectification from first principles.Physical review applied · 2026Article
- Synergetic properties of advanced materials for high-power and high-temperature applications.Discover nano · 2026Review
- Upconverting Nanoparticle Thermometry beyond the Diffraction Limit.Accounts of chemical research · 2026Article
- Metallic θ-phase tantalum nitride has a thermal conductivity triple that of copper.Science (New York, N.Y.) · 2026Article
- Numerical Study on Heat Transfer Performance of Turbulence Enhancement Configurations for Galinstan Based Mini-Channel Cooling.Micromachines · 2026Article
- Anisotropic Thermal Conductivity in Pellet-Based 3D-Printed Polymer Structures for Advanced Heat Management in Electrical Devices.Polymers · 2025Article
- Reduced Anisotropic in Thermal Conductivity of Polymer Composites via Chemically Bonded BN-SiC Hybrid Fillers.Polymers · 2025Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
6 authors.
Funding
Abstract
Power semiconductors and chips are essential in modern electronics, driving applications from personal devices and data centers to energy technologies, vehicles, and Internet infrastructure. However, efficient heat dissipation remains a critical challenge, directly affecting their performance, reliability, and lifespan. High-power electronics based on wide- and ultrawide-bandgap semiconductors can exhibit power densities exceeding 10 kW/cm
Identifiers
What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.