ArticleFrontiers of optoelectronics2025
Simulation and experimental investigation of liquid-cooling thermal management for high-bandwidth co-packaged optics.
Article in Frontiers of optoelectronics, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
1 citing paper in PubMed.
- Multi-channel high-speed flip-chip packaging platform for thin-film lithium niobate photonic circuits.National science review · 2026Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
6 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
This study explores the application of cold plate liquid cooling technology in co-packaged optics (CPO). By integrating optical modules and the switch chip on the same substrate, CPO shortens the electrical interconnection distance, effectively solving the problems of high power consumption and poor signal integrity of traditional pluggable optical modules under high bandwidth. However, the surge in power density and the thermal crosstalk resulting from high integration density make thermal management one of the key challenges that constrain the reliability of high-capacity co-packaged optics. For the unique architecture of CPO, this study analyzes its heat dissipation needs in detail, and a thermal management scheme is designed. The thermal management scheme is simulated and optimized based on the Navier-Stokes equation. The simulation results show that, in a 51.2 Tbit/s CPO system, the junction temperature of the switch chip is 97.3 °C, the maximum junction temperature of the optical modules is 31.3 °C, and the temperature difference between the optical modules is 2.4 °C to 1.2 °C. To verify the simulation results, a thermal test experimental platform is built, and the experimental results show that the temperature simulation difference is within 4% and the pressure change trend is consistent with the simulation. Combining the experimental data and simulation results, the designed heat sink can satisfy the heat dissipation demands of the 51.2 Tbit/s bandwidth CPO system. This conclusion demonstrates the potential of liquid-cooling technology in CPO, providing support for research on liquid-cooling technology in the CPO. The design provides a theoretical and practical basis for the high performance and reliability of optoelectronic integration technology in wavelength division multiplexing (WDM) systems and micro-ring device applications, contributing to the application of next-generation optical communication networks.
Indexed as
Identifiers
What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.