Soldering and Bonding in Contemporary Electronic Device Packaging.

Yuxuan Li, Bei Pan, Zhenting Ge, Pengpeng Chen, Bo Bi, Xin Yi, Chaochao Wu, Ce Wang

Abstract readReview

In one paragraph

Review in Materials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it

0cells of the map it votes in

1citing papers in PubMed

–field-weighted citation impact

1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

Research on the Parasitic Inductance of the Bonding Wires in IGBT Modules Based on Their Morphology and Layout.Micromachines · 2025
Article

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

8 authors.

Yuxuan LiNanjing Electronic Devices Institute, Nanjing 210000, China.ORCID 0000-0002-0880-0673

Bei PanNanjing Electronic Devices Institute, Nanjing 210000, China.

Zhenting GeNanjing Electronic Devices Institute, Nanjing 210000, China.

Pengpeng ChenNanjing Electronic Devices Institute, Nanjing 210000, China.

Bo BiNanjing Electronic Devices Institute, Nanjing 210000, China.

Xin YiNanjing Electronic Devices Institute, Nanjing 210000, China.

Chaochao WuSchool of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, China.ORCID 0000-0001-5799-741X

Ce WangState Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001, China.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Electronic packaging can transform the chip to a device for assembly. Soldering and bonding are important procedures in the process of electronic packaging. The continuous development of packaging architecture has driven the emergence of improved soldering and bonding processes. At the same time, conventional soldering and bonding processes are still widely used in device packaging. This paper introduces two kinds of technologies in wafer bonding, direct and indirect, expounds on five kinds of die attachment processes, and also describes the process of ball bonding and wedge bonding in wire bonding in detail. Flip chip bonding and methods for making bumps are also described in depth. Bump bonding processes are vital for 3D-SiP packages, and the bonding technology of copper bumps is a research hotspot in the field of advanced packaging. The surface mount technology and sealing technology used in some electronic devices are also briefly introduced. This paper provides insights for researchers studying soldering and bonding in contemporary electronic device packaging.

Indexed as

die attachmentelectronic packagingflip chip bondingsolderingwafer bondingwire bonding

Identifiers

PMID40363524

DOI10.3390/ma18092015

PMCPMC12072841

What OpenQuestion holds

Textmetadata

LicenceCC BY

Read underepoch 390

Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.