ArticleMaterials (Basel, Switzerland)2025
Investigation of the Etching Resistance of Yttrium Oxyfluoride Coating Deposited via Atmospheric Plasma Spraying Against Cl
Article in Materials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Abstract
Chlorine-based plasma is widely used in key etching applications. However, while etching the wafer materials, chlorine plasma can cause damage to the internal components of the etching chamber, which adversely affects the equipment's lifespan. As a result, selecting appropriate coating materials for the chamber's internal components is essential for mitigating corrosion. The etch resistance of these coatings directly impacts not only the quality of wafer production but also the operational safety and maintenance cycle of the etching equipment. In this study, three yttrium oxyfluoride coatings with different oxygen contents (3%, 6%, and 9%) were prepared using atmospheric plasma spraying technology. The etch resistance of these YOF coatings, as well as yttrium oxide coating, was systematically investigated under a Cl
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