Evidence map›Paper›PMID 40307371›Full record

ArticleScientific reports2025

A novel modeling and analysis of mechanical properties of single-component thermal conductive silica gel.

Yuezhen Wang, Xiaoguang Li, Zhifeng Liu, Zhichao Jiang, Zhijie Li, Ying Li

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Scientific reports, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

6 authors.

Yuezhen WangSchool of Liberal Arts and Sciences, North China Institute of Aerospace Engineering, Langfang, 065000, China. wyz@nciae.edu.cn.
Xiaoguang LiSchool of Mechanical and Electrical Engineering, North China Institute of Aerospace Engineering, Langfang, 065000, China.
Zhifeng LiuKey Laboratory of CNC Equipment Reliability, Ministry of Education, School of Mechanical and Aerospace Engineering, Jilin University, Changchun, 130012, China.
Zhichao JiangSchool of Liberal Arts and Sciences, North China Institute of Aerospace Engineering, Langfang, 065000, China.
Zhijie LiSchool of Mechanical and Electrical Engineering, North China Institute of Aerospace Engineering, Langfang, 065000, China.
Ying LiInstitute of Advanced Manufacturing and Intelligent Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China.

Funding

Central guidance for local scientific and technological development funding projects 246Z1823GNational Natural Science Foundation of China 52205510North China Institute of Aerospace Engineering Doctoral Research Initiation Fund BKY-2024-01Science Research Project of Hebei Education Department BJK2024043
6 · The paper itself

Abstract

Single-component thermal conductive silica gel (S-TCSG) is a new type of thermal conductive material for packaging electronic components in high-performance printed circuit boards. Its mechanical properties can lead to excessive deformation of printed circuit boards or even solder joint fracture during screw fastening or falling. In this paper, an experimental program was developed to study the mechanical properties of the S-TCSG, such as cushioning property, creep and stress relaxation. The relationship model is established between cushioning coefficient, compression stress and compression strain on the basis of the compression stress-strain test. In addition, the time-varying laws of the compression creep and stress relaxation of the S-TCSG were studied experimentally. The elastic modulus, relaxation modulus and creep compliance can be obtained based on the experimental data. A nonlinear finite element model (FEM) of the S-TCSG is established. Furthermore, the influence of gel thickness on stress distribution is analyzed in screw tightening. A mathematical model is proposed to characterize the relationship between gel thickness, compressive stress and displacement load. This study is of great practical significance to the rationality of coating thickness of the S-TCSG and the performance improvement of printed circuit boards.

Indexed as

Bolted jointsCreepCushioning propertySingle-component thermal conductive silica gelStress relaxation

Identifiers

PMID40307371
PMCPMC12043950

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.