Achieving Low Dissipation Factors and Low Dielectric Constants via Thermally Stable Naphthalene-Based Poly(ester-imide)s with Fluorine Groups.

Manohar Reddy Busireddy, Ling-Huan Meng, Jin-Wei Lin, Wei-Chung Ke, Jiun-Tai Chen, Chain-Shu Hsu

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Article in ACS applied materials & interfaces, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.

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2citing papers in PubMed

–field-weighted citation impact

1 · What the graph read from it

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3 · Its place in the literature

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2 citing papers in PubMed.

Thermal and Mechanical Behavior of Polyimide-Polyurea Copolymers: Insights from Molecular Dynamics Simulations.Polymers · 2026
Article
Facile Strategy Enabling Fluorine-Free Polyimides with Ultralow Dielectric Loss and Thermal Expansion Close to Copper.ACS applied materials & interfaces · 2026
Article

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6 authors.

Manohar Reddy BusireddyDepartment of Applied Chemistry, National Yang Ming Chiao Tung University, 1001 University Road, Hsinchu 300093, Taiwan.ORCID 0000-0002-0997-3007

Ling-Huan MengDepartment of Applied Chemistry, National Yang Ming Chiao Tung University, 1001 University Road, Hsinchu 300093, Taiwan.

Jin-Wei LinDepartment of Applied Chemistry, National Yang Ming Chiao Tung University, 1001 University Road, Hsinchu 300093, Taiwan.ORCID 0009-0005-6031-5914

Wei-Chung KeDepartment of Applied Chemistry, National Yang Ming Chiao Tung University, 1001 University Road, Hsinchu 300093, Taiwan.

Jiun-Tai ChenDepartment of Applied Chemistry, National Yang Ming Chiao Tung University, 1001 University Road, Hsinchu 300093, Taiwan.ORCID 0000-0002-0662-782X

Chain-Shu HsuDepartment of Applied Chemistry, National Yang Ming Chiao Tung University, 1001 University Road, Hsinchu 300093, Taiwan.ORCID 0000-0002-8312-2921

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

In recent years, polyimides (PIs) and their functional derivatives (i.e., poly(ester-imide)s (PEIs), poly(amide-imide)s (PAIs), etc.) have gained more attention in the microelectronic and optoelectronic industries because of their excellent thermal-mechanical stabilities, heat resistance, dielectric properties, and solution processabilities. Nevertheless, developing PIs with low dielectric constants (

Indexed as

high thermal stabilitylow dielectric constantmolar free volumenaphthalenepoly(ester-imide)strifluoromethyl groupsultralow dissipation factor

Identifiers

PMID40082250

DOI10.1021/acsami.5c00599

PMCPMC11956007

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