ArticleMaterials (Basel, Switzerland)2025
Burst Ultrafast Laser Welding of Quartz Glass.
Article in Materials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.
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2 citing papers in PubMed.
- Process Parameter Optimization and Crack Formation Mechanism of Femtosecond Laser Welding of Fused Silica/6061 Aluminum Alloy.Nanomaterials (Basel, Switzerland) · 2026Article
- Millisecond Laser Oblique Hole Processing of Alumina Ceramics.Nanomaterials (Basel, Switzerland) · 2025Article
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7 authors.
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Abstract
Ultrafast laser welding of transparent materials has been widely used in sensors, microfluidics, optics, etc. However, the existing ultrafast laser welding depths are limited by the short laser Rayleigh length, which makes it difficult to realize the joining of transparent materials in the millimeter depth range and becomes a new challenge. Based on temporal shaping, we realized Burst mode ultrafast laser output with different sub-pulse numbers and explored the effect of different Burst modes on the welding performance using high-speed shadow in situ imaging. The experimental results show that the Burst mode femtosecond laser (twelve sub-pulses with a total energy of 28.9 μJ) of 238 fs, 1035 nm and 1000 kHz can form a molten structure with a maximum depth of 5 mm inside the quartz, and the welding strength can be higher than 18.18 MPa. In this context, we analyzed the transient process of forming teardrop molten structures inside transparent materials using high-speed shadow in situ imaging detection and systematically analyzed the fracture behavior of the samples. In addition, we further reveal the Burst femtosecond laser welding mechanism of transparent materials comprehensively by exploring the difference in welding performance under the effect of Burst modes with different sub-pulse numbers. This paper is the first to realize molten structures in the range of up to 5 mm, which is expected to provide a new welding method for curved surfaces and large-size transparent materials, helping to improve the packaging strength of photoelectric devices and the window strength of aerospace materials.
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