A comparative evaluation of the efficacy of three commonly used diode lasers (810, 940, and 980-nanometer) to solder skin incisions: an experimental study in the rat.

The evolution of wound closure methods has led to the exploration of new and improved techniques such as laser tissue soldering. This study aimed to compare the effects of 810, 940, and 980 nm diode lasers and suturing to identify the most effective wavelength for soldering skin incisions. Three sets of incisions were bound on the backs of 63 rats using diode lasers and sutures. A combination of bovine serum albumin (50%), indocyanine green, and sodium hyaluronate was used as a solder. Healing progress was assessed on the 1st, 4th, 7th, 14th, and 21st days after surgery through histological examination and measurements of tensile strength. Although immediate superficial closure was found for the laser-bonded incisions, on the 4th day, the entire thickness of the incision was closed only in the 810 nm laser group. Thermal damage was observed for all the laser-irradiated groups. For the sutured group, the incisions remained unclosed for the first day, and openings through the incision were observed. The incisions treated with a 980 nm laser had the highest amount of tensile strength. At the end of the 21-day recovery period, no significant differences between experimental groups were observed in terms of the histological and tensile strength values. All studied diode lasers can effectively repair incisions similar to a suture, but the 980 nm treated incisions will be significantly more resistant to mechanical tension. The 810 nm diode laser demonstrated the earliest wound closure, which could benefit areas requiring more aesthetic consideration.