Evidence map›Paper›PMID 39859788›Full record

ArticleMaterials (Basel, Switzerland)2025

Tribo-Electrochemical Mechanism of Material Removal Examined for Chemical Mechanical Planarization of Stainless-Steel Using Citrate Buffer as a Complexing Agent.

David R Santefort, Kassapa U Gamagedara, Dipankar Roy

Abstract read
In one paragraph

Article in Materials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

3 authors.

David R SantefortDepartment of Physics, Clarkson University, Potsdam, NY 13699-5820, USA.
Kassapa U GamagedaraDepartment of Physics, Clarkson University, Potsdam, NY 13699-5820, USA.
Dipankar RoyDepartment of Physics, Clarkson University, Potsdam, NY 13699-5820, USA.ORCID 0000-0002-8351-5493

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Chemical mechanical planarization (CMP) is a technique used to efficiently prepare defect-free, flat surfaces of stainless steel (SS) foils and sheets that are implemented in various modern devices. CMP uses (electro)chemical reactions to structurally weaken the surface layers of a workpiece for easy removal by low-pressure mechanical abrasion. Using a model CMP system of 316/316L stainless steel (SS) in an acidic (pH = 3.63) slurry with alumina abrasives, citrate buffer (CB), and H

Indexed as

chemical–mechanical planarizationremovable surface filmsalt filmstainless steeltribo-corrosiontribo-electrochemistry

Identifiers

PMID39859788
PMCPMC11767002

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.