ArticleMicromachines2024
Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications.
Article in Micromachines, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 3 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
3 citing papers in PubMed.
- A review of glass thermal reflow: method, device, and applications.Microsystems & nanoengineering · 2026Review
- Electro-Thermal Co-Design and Verification of TGV Transmission Structures for High-Power High-Frequency Applications.Micromachines · 2026Article
- Glass-Based Half-Mode SIW Bandpass Filter with Negative Coupling Structure.Micromachines · 2026Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
7 authors.
Funding
Abstract
This paper presents a novel approach to fabricate substrate integrated waveguides (SIWs) on glass substrates with tin (Sn) through glass vias (TGVs) tailored for millimeter-wave applications. The fabrication process employs a custom-designed vacuum suctioning system to rapidly fill precise TGV holes in the glass substrate, which are formed by wafer-level glass reflow micromachining techniques with molten tin in a minute. This method offers a very fast and cost-effective alternative for complete via filling without voids compared to the conventional metallization techniques such as electroplating or sputtering. An SIW with a 3-dB cutoff frequency of 17.2 GHz was fabricated using the proposed process. The fabricated SIW shows an average insertion loss of 1.65 ± 0.54 dB across the 20-35 GHz range. These results highlight the potential of glass substrates with tin TGVs for fabricating millimeter-wave devices.
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Registered trials
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