Evidence map›Paper›PMID 39824798›Full record

ArticleNature communications2025

Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling.

Rui Cheng, Qixian Wang, Zexiao Wang, Lin Jing, Ana V Garcia-Caraveo, Zhuo Li, Yibai Zhong, Xiu Liu, Xiao Luo, Tianyi Huang and 6 more

Abstract read
In one paragraph

Article in Nature communications, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 8 papers.

0numbers the graph read from it
0cells of the map it votes in
8citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

8 citing papers in PubMed.

  1. Review
  2. Review
  3. Article
  4. Article
  5. Thermal Utilization on Chip.Light, science & applications · 2026
    Article
  6. Article
  7. Article
  8. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

16 authors.

Rui Cheng *Department of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, USA.ORCID http://orcid.org/0000-0002-2457-4805
Qixian Wang *Department of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, USA.
Zexiao Wang *Department of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, USA.
Lin Jing *Department of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, USA.
Ana V Garcia-CaraveoCollege of Engineering, Oregon State University, 1791 SW Campus Way, Corvallis, OR, USA.ORCID http://orcid.org/0000-0002-0392-5055
Zhuo LiDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, USA.ORCID http://orcid.org/0000-0003-3861-3681
Yibai ZhongDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, USA.ORCID http://orcid.org/0009-0007-5741-9151
Xiu LiuDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, USA.ORCID http://orcid.org/0009-0000-1802-691X
Xiao LuoDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, USA.ORCID http://orcid.org/0000-0002-3526-7333
Tianyi HuangDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, USA.
Hyeong Seok YunDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, USA.
Hakan SalihogluDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, USA.
Loren RussellArieca, Inc., 201 N Braddock Ave STE 334, Pittsburgh, PA, USA.
Navid KazemArieca, Inc., 201 N Braddock Ave STE 334, Pittsburgh, PA, USA.
Tianyi ChenCollege of Engineering, Oregon State University, 1791 SW Campus Way, Corvallis, OR, USA.ORCID http://orcid.org/0000-0003-2880-824X
Sheng ShenDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, USA. sshen1@cmu.edu.ORCID http://orcid.org/0000-0002-9951-0814

Funding

DOE | Advanced Research Projects Agency - Energy (Advanced Research Projects Agency - Energy - U.S. Department of Energy) No. DE-AR0001761National Science Foundation (NSF) No. TIP-2414733
6 · The paper itself

Abstract

Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inevitable in electronics, thermal resistance at interfaces has emerged as a critical bottleneck for thermal management. However, existing thermal interface solutions are constrained by either high thermal resistance or poor reliability. We report a strategy to create printable, high-performance liquid-infused nanostructured composites, comprising a mechanically soft and thermally conductive double-sided Cu nanowire array scaffold infused with a customized thermal-bridge liquid that suppresses contact thermal resistance. The liquid infusion concept is versatile for a broad range of thermal interface applications. Remarkably, the liquid metal infused nanostructured composite exhibits an ultra-low thermal resistance <1 mm² K W

Identifiers

PMID39824798
PMCPMC11742011

What OpenQuestion holds

Textmetadata
LicenceCC BY-NC-ND
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.