ArticleMaterials (Basel, Switzerland)2024
An Investigation on the Spark Plasma Sintering Diffusion Bonding of Diamond/Cu Composites with a Cr Interlayer.
Article in Materials (Basel, Switzerland), 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 4 papers.
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Who cites it
4 citing papers in PubMed.
- Amorphization-Densification Coupling Governs Hardness Enhancement in SPS-Consolidated Al-Fe-Nb-(Ni,Ti) Metastable Alloys.Materials (Basel, Switzerland) · 2026Article
- Effects of Annealing Temperature on Interfacial Structure and Thermal Conductivity of Hot-Pressed Copper/Cr-Coated Diamond Composites.Materials (Basel, Switzerland) · 2026Article
- Influence of Pure Aluminum and 7075 Aluminum Alloy Powder Interlayers on the Microstructural and Mechanical Properties of Diffusion-Bonded 7B04 Aluminum Alloy Joints.Materials (Basel, Switzerland) · 2025Article
- Interface Optimization and Thermal Conductivity of Cu/Diamond Composites by Spark Plasma Sintering Process.Nanomaterials (Basel, Switzerland) · 2025Article
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Authors and funding
6 authors.
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Abstract
Spark plasma sintering (SPS) is an effective technique for studying the diffusion bonding of diamond/Cu composites, and has the potential to advance the application of copper matrix composites. This study investigates the SPS diffusion bonding of diamond/Cu composites using a chromium (Cr) interlayer. The effects of process parameters on the microstructure and mechanical properties of the bonding interface were evaluated through shear strength testing and SEM analysis. The results show that shear strength increases with interlayer thickness up to a certain point, after which it decreases. As the bonding temperature, holding time, and bonding pressure increase, defects such as cracks and voids at the diffusion-bonded interface are reduced, resulting in improved shear strength. Under suitable conditions (10 μm interlayer, 810 °C, 60 min, and 10 MPa), the bonding interface is defect-free, achieving a maximum shear strength of 139.89 MPa and a thermal conductivity (TC) of 700.97 W/(m·K), indicating high-quality diffusion bonding.
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