Combining one and two photon polymerization for accelerated high performance (3 + 1)D photonic integration.

Dense and efficient circuits with component sizes approaching the physical limit is the hallmark of high performance integration. Ultimately, these features and their pursuit enabled the multi-decade lasting exponential increase of components on integrated electronic chips according to Moore's law, which culminated with the high performance electronics we know today. However, current fabrication technology is mostly constrained to 2D lithography, and thermal energy dissipation induced by switching electronic signal lines presents a fundamental challenge for truly 3D electronic integration. Photonics reduces this problem, and 3D photonic integration is therefore a highly sought after technology that strongly gains in relevance due to the need for scalable application-specific integrated circuits for neural networks. Direct laser writing of a photoresin is a promising high-resolution and complementary metal-oxide-semiconductor (CMOS) compatible tool for 3D photonic integration. Here, we combine one and two-photon polymerization (TPP) for waveguide integration for the first time, dramatically accelerating the fabrication process and increasing optical confinement. 3D additive printing is based on femtosecond TPP, while blanket irradiation with a UV lamp induces one-photon polymerization (OPP) throughout the entire 3D chip. We locally and dynamically adjust writing conditions to implement (3 + 1)D