ArticleScientific reports2024
Effective preparation of low-melting solder materials for atom probe tomography.
Article in Scientific reports, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
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Who cites it
1 citing paper in PubMed.
- Sample preparation induced artefacts in soft SAC solders from uncooled and cooled Argon ion milling.Scientific reports · 2025Article
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Authors and funding
6 authors.
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Abstract
Low-melting metal alloys have gained renewed attention for additive manufacturing, energy storage and microelectronics. However, micro- and nanostructure characterisation demands highly sophisticated sample preparation. Here, we optimise the Ga-FIB preparation of atom probe tomography (APT) specimens for low melting SAC305 solder materials utilising different FESEM/FIB stage temperatures. We study the effects of FESEM/FIB stage temperature on the specimen milling behaviour during Ga-FIB preparation and compare the extent of Ga implantation and precipitate coarsening during the preparation utilising energy dispersive X-ray spectroscopy and APT. We show that cooling the sample to -60 °C during FIB milling utilising a Peltier cooling stage improves the behaviour of the specimen during the final low-keV milling step significantly. We conclude that performing all Ga-FIB-sample interactions at -60 °C with a Pt-protection layer allows for effective and reproducible APT specimen preparation for low-melting alloys, such as SAC305.
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