Evidence map›Paper›PMID 39516458›Full record

ArticleNature communications2024

Oriented Bi

Guoying Dong, Jianghe Feng, Guojuan Qiu, Yuxuan Yang, Qiyong Chen, Yang Xiong, Haijun Wu, Yifeng Ling, Lili Xi, Chen Long and 6 more

Abstract read
In one paragraph

Article in Nature communications, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 9 papers.

0numbers the graph read from it
0cells of the map it votes in
9citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

9 citing papers in PubMed.

  1. Article
  2. Flexible AgAdvanced materials (Deerfield Beach, Fla.) · 2026
    Review
  3. Article
  4. Article
  5. Article
  6. Interface-Engineered BiSmall (Weinheim an der Bergstrasse, Germany) · 2026
    Article
  7. Article
  8. Homo-layer flexible BiScience advances · 2025
    Article
  9. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

16 authors.

Guoying Dong *Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
Jianghe Feng *Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
Guojuan Qiu *Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
Yuxuan YangState Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, China.
Qiyong ChenMaterials Genome Institute, Shanghai University, Shanghai, China.
Yang XiongShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
Haijun WuState Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, China. wuhaijunnavy@xjtu.edu.cn.ORCID http://orcid.org/0000-0002-7303-379X
Yifeng LingShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
Lili XiMaterials Genome Institute, Shanghai University, Shanghai, China.
Chen LongShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
Jibao LuShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.ORCID http://orcid.org/0000-0002-3621-5404
Yixin QiaoShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
Guijuan LiShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
Juan LiShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China. j.li1@siat.ac.cn.ORCID http://orcid.org/0000-0003-4419-5391
Ruiheng LiuShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China. rh.liu@siat.ac.cn.ORCID http://orcid.org/0000-0003-3855-4052
Rong SunShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.

Funding

National Natural Science Foundation of China (National Science Foundation of China) 22309120National Natural Science Foundation of China (National Science Foundation of China) 52472268
6 · The paper itself

Abstract

Film-thermoelectric cooling devices are expected to provide a promising active thermal management solution with the continues increase of the power density of integrated circuit chips and other electronic devices. However, because the microstructure-related performance of thermoelectric films has not been perfectly matched with the device configuration, the potential of planar devices on chip heat dissipation has still not been fully exploited. Here, by liquid Te assistant growth method, highly (00 l) orientated Bi

Identifiers

PMID39516458
PMCPMC11549465

What OpenQuestion holds

Textmetadata
LicenceCC BY-NC-ND
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.