Novel design and implementation of 3d packaged wideband bandpass filters.

This study presents an innovative method for designing a 3D packaged wideband bandpass filter (BPF) by vertically integrating a high-pass filter (HPF) and a low-pass filter (LPF) using an air cavity and vertical interconnect accesses (VIAs). This integration enhances performance while significantly reducing system size. The fabricated BPF, constructed on multilayer substrates, achieves a passband from 2.175 to 4.2 GHz with less than 2.5 dB insertion loss and a return loss exceeding 10 dB. The design utilizes a partial substrate integrated suspended line (SISL) structure, enabling precise control over the equivalent dielectric constant and characteristic impedance to optimize insertion loss. The height of the air cavity, determined through theoretical analysis and S-parameter inversion, is critical for achieving optimal filter performance. The methodology allows for independent circuit designs on each layer, resulting in a 3D assembly. This refined approach makes it easier to produce compact bandpass and multi-band filters, simplifying circuit development and enabling scalable fabrication. This design is versatile across different frequency ranges, demonstrating significant practical and theoretical benefits.