ArticlePolymers2024
Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint.
Article in Polymers, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
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Who cites it
1 citing paper in PubMed.
- Electrochemical migration behavior of SnAgCuNi solder alloy in a simulated dew condensation environment.RSC advances · 2025Article
Corrections and comments
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Authors and funding
6 authors.
Funding
Abstract
In this work, epoxy was added into commercial Sn-3.0Ag-0.5Cu (SAC305) solder paste to enhance the thermal cycling reliability of the joint. The microstructure and fracture surface were observed using a scanning electron microscope/energy dispersive spectrometer (SEM/EDS), and a shear test was performed on the thermally cycled joint samples. The results indicated that during the thermal cycling test, the epoxy protective layer on the surface of the epoxy-enhanced SAC305 solder joint could significantly alleviate the thermal stress caused by coefficients of thermal expansion (CTE) mismatch, resulting in fewer structural defects. The interfacial compound of the original SAC305 solder joints gradually coarsened due to the accelerated atomic diffusion, but epoxy-enhanced SAC305 solder joints demonstrated a thinner interfacial layer and a smaller IMC grain size. Due to the reduced stress concentration and the additional mechanical support provided by the cured epoxy layer, epoxy-enhanced SAC305 solder joints displayed superior shear performance compared to the original joint during the thermal cycling test. After 1000 thermal cycles, Cu-Sn IMC regions were observed on the fracture surfaces of the original SAC305 solder joint, exhibiting brittle fracture characteristics. However, the fracture of the SAC305 solder joint with 8 wt.% epoxy remained within the solder bulk and exhibited a ductile fracture mode. This work indicates that epoxy-enhanced SAC305 solder pastes display high thermal cycling reliability and could meet the design needs of advanced packaging technology for high-performance electronic packaging materials.
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Registered trials
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