Evidence map›Paper›PMID 39333109›Full record

ArticleNature communications2024

Pressure-constrained sonication activation of flexible printed metal circuit.

Lingxiao Cao, Zhonghao Wang, Daiwei Hu, Haoxuan Dong, Chunchun Qu, Yi Zheng, Chao Yang, Rui Zhang, Chunxiao Xing, Zhen Li and 4 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Nature communications, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 3 papers.

0numbers the graph read from it
0cells of the map it votes in
3citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

3 citing papers in PubMed.

  1. Article
  2. Article
  3. Review
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

14 authors.

Lingxiao Cao *Center for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.
Zhonghao Wang *Center for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.ORCID http://orcid.org/0009-0004-7227-3929
Daiwei HuCenter for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.
Haoxuan DongCenter for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.
Chunchun QuCenter for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.
Yi ZhengCenter for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.
Chao YangCenter for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.
Rui ZhangCenter for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.
Chunxiao XingCenter for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.
Zhen LiCenter for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.
Zhe XinCenter for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.
Du ChenCenter for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.
Zhenghe SongCenter for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China.
Zhizhu HeCenter for Agricultural Flexible Electronics Technology, College of Engineering, China Agricultural University, Beijing, 100083, China. zzhe@cau.edu.cn.ORCID http://orcid.org/0000-0001-8861-9964

Funding

National Natural Science Foundation of China (National Science Foundation of China) 52076213
6 · The paper itself

Abstract

Metal micro/nanoparticle ink-based printed circuits have shown promise for promoting the scalable application of flexible electronics due to enabling superhigh metallic conductivity with cost-effective mass production. However, it is challenging to activate printed metal-particle patterns to approach the intrinsic conductivity without damaging the flexible substrate, especially for high melting-point metals. Here, we report a pressure-constrained sonication activation (PCSA) method of the printed flexible circuits for more than dozens of metal (covering melting points from room temperature to 3422 °C) and even nonmetallic inks, which is integrated with the large-scale roll-to-roll process. The PCSA-induced synergistic heat-softening and vibration-bonding effect of particles can enable multilayer circuit interconnection and join electronic components onto printed circuits without solder within 1 s at room temperature. We demonstrate PCSA-based applications of 3D flexible origami electronics, erasable and foldable double-sided electroluminescent displays, and custom-designed and large-area electronic textiles, thus indicating its potential for universality in flexible electronics.

Identifiers

PMID39333109
PMCPMC11436825

What OpenQuestion holds

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LicenceCC BY-NC-ND
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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.