Evidence map›Paper›PMID 39327511›Full record

ArticleNature nanotechnology2025

Mechanochemistry-mediated colloidal liquid metals for electronic device cooling at kilowatt levels.

Kai Wu, Zhengli Dou, Shibo Deng, Die Wu, Bin Zhang, Haobo Yang, Runlai Li, Chuxin Lei, Yongzheng Zhang, Qiang Fu and 1 more

Abstract read
PubMed Publisher
In one paragraph

Article in Nature nanotechnology, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 13 papers.

0numbers the graph read from it
0cells of the map it votes in
13citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

13 citing papers in PubMed.

  1. Article
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  10. Review
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  13. Controlled Growth of Graphene-Skinned AlAdvanced science (Weinheim, Baden-Wurttemberg, Germany) · 2025
    Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

11 authors.

Kai Wu *College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, China. kaiwu@scu.edu.cn.ORCID http://orcid.org/0000-0002-7057-0442
Zhengli Dou *College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, China.
Shibo Deng *College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, China.
Die WuCollege of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, China.
Bin ZhangCollege of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, China.
Haobo YangSchool of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan, China.
Runlai LiCollege of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, China.ORCID http://orcid.org/0000-0002-1857-2037
Chuxin LeiMaterials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, TX, USA.
Yongzheng ZhangCollege of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, China.
Qiang FuCollege of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, China. qiangfu@scu.edu.cn.ORCID http://orcid.org/0000-0002-5191-3315
Guihua YuMaterials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, TX, USA. ghyu@austin.utexas.edu.ORCID http://orcid.org/0000-0002-3253-0749

Funding

National Natural Science Foundation of China (National Science Foundation of China) 52373042 and 52103091Welch Foundation F-1861
6 · The paper itself

Abstract

Electronic systems and devices operating at significant power levels demand sophisticated solutions for heat dissipation. Although materials with high thermal conductivity hold promise for exceptional thermal transport across nano- and microscale interfaces under ideal conditions, their performance often falls short by several orders of magnitude in the complex thermal interfaces typical of real-world applications. This study introduces mechanochemistry-mediated colloidal liquid metals composed of Galinstan and aluminium nitride to bridge the practice-theory disparity. These colloids demonstrate thermal resistances of between 0.42 and 0.86 mm

Identifiers

What OpenQuestion holds

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Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.