Evidence map›Paper›PMID 39193864›Full record

ArticleAdvanced science (Weinheim, Baden-Wurttemberg, Germany)2024

Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks.

Minjun Ai, Yuzhu Song, Feixiang Long, Yuanpeng Zhang, Ke An, Dunji Yu, Yan Chen, Yuki Sakai, Masahito Ikeda, Kazuki Takahashi and 4 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Advanced science (Weinheim, Baden-Wurttemberg, Germany), 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

14 authors.

Minjun AiDepartment of Physical Chemistry, Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing, 100083, China.ORCID https://orcid.org/0009-0004-4046-3242
Yuzhu SongDepartment of Physical Chemistry, Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing, 100083, China.ORCID https://orcid.org/0000-0002-7618-4286
Feixiang LongDepartment of Physical Chemistry, Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing, 100083, China.
Yuanpeng ZhangNeutron Scattering Division, Oak Ridge National Laboratory, Oak Ridge, TN, 37831, USA.
Ke AnNeutron Scattering Division, Oak Ridge National Laboratory, Oak Ridge, TN, 37831, USA.
Dunji YuNeutron Scattering Division, Oak Ridge National Laboratory, Oak Ridge, TN, 37831, USA.
Yan ChenNeutron Scattering Division, Oak Ridge National Laboratory, Oak Ridge, TN, 37831, USA.
Yuki SakaiKanagawa Institute of Industrial Science and Technology (KISTEC), 705-1 Shimoimaizumi, Ebina, Kanagawa, 243-0435, Japan.
Masahito IkedaLaboratory for Materials and Structures, Institute of Innovative Research, Tokyo Institute of Technology, Yokohama, 226-8503, Japan.
Kazuki TakahashiLaboratory for Materials and Structures, Institute of Innovative Research, Tokyo Institute of Technology, Yokohama, 226-8503, Japan.
Masaki AzumaKanagawa Institute of Industrial Science and Technology (KISTEC), 705-1 Shimoimaizumi, Ebina, Kanagawa, 243-0435, Japan.
Naike ShiDepartment of Physical Chemistry, Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing, 100083, China.
Chang ZhouDepartment of Physical Chemistry, Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing, 100083, China.ORCID https://orcid.org/0000-0001-8198-3827
Jun ChenDepartment of Physical Chemistry, Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing, 100083, China.ORCID https://orcid.org/0000-0002-7330-8976

Funding

National Key R&D Program of China 2022YFE0109100National Natural Science Foundation of China 12104038National Natural Science Foundation of China 22205016National Natural Science Foundation of China 22235002National Natural Science Foundation of China 22275014
6 · The paper itself

Abstract

Rapid advancements in electronic devices yield an urgent demand for high-performance electronic packaging materials with high thermal conductivity, low thermal expansion, and great mechanical properties. However, it is a great challenge for current design philosophies to fulfill all the requirements simultaneously. Here, an effective strategy is proposed for significantly promoting the thermal conductivity and machinability of negative thermal expansion alloy (Zr,Nb)Fe

Indexed as

copper networkseutectic precipitationhigh thermal conductivitynegative thermal expansion

Identifiers

PMID39193864
PMCPMC11515899

What OpenQuestion holds

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.