Evidence map›Paper›PMID 38977674›Full record

ArticleLight, science & applications2024

Anneal-free ultra-low loss silicon nitride integrated photonics.

Debapam Bose, Mark W Harrington, Andrei Isichenko, Kaikai Liu, Jiawei Wang, Nitesh Chauhan, Zachary L Newman, Daniel J Blumenthal

Abstract read
In one paragraph

Article in Light, science & applications, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 15 papers.

0numbers the graph read from it
0cells of the map it votes in
15citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

15 citing papers in PubMed.

  1. Review
  2. Article
  3. Article
  4. Article
  5. Amorphous metal oxide mixtures for high-Communications physics · 2026
    Article
  6. Article
  7. Article
  8. Multifunctional van der Waals PdSeNature communications · 2025
    Article
  9. Article
  10. Review
  11. Review
  12. Article
  13. Article
  14. Article
  15. Ultra-low loss silicon nitride becomes even cooler.Light, science & applications · 2024
    Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

8 authors.

Debapam BoseDepartment of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, CA, 93106, USA.ORCID http://orcid.org/0009-0003-2590-0582
Mark W HarringtonDepartment of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, CA, 93106, USA.
Andrei IsichenkoDepartment of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, CA, 93106, USA.ORCID http://orcid.org/0000-0002-5373-4396
Kaikai LiuDepartment of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, CA, 93106, USA.ORCID http://orcid.org/0000-0002-1360-9646
Jiawei WangDepartment of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, CA, 93106, USA.ORCID http://orcid.org/0000-0002-5796-5220
Nitesh ChauhanDepartment of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, CA, 93106, USA.ORCID http://orcid.org/0000-0002-7375-3690
Zachary L NewmanOctave Photonics, Louisville, CO, 80027, USA.
Daniel J BlumenthalDepartment of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, CA, 93106, USA. danb@ucsb.edu.ORCID http://orcid.org/0000-0002-1735-7220

Funding

United States Department of Defense | Defense Advanced Research Projects Agency (DARPA) HR0011-22-2-0008United States Department of Defense | United States Army | U.S. Army Research, Development and Engineering Command | Army Research Laboratory (U.S. Army Research Laboratory) W911NF-22-2-0056
6 · The paper itself

Abstract

Heterogeneous and monolithic integration of the versatile low-loss silicon nitride platform with low-temperature materials such as silicon electronics and photonics, III-V compound semiconductors, lithium niobate, organics, and glasses has been inhibited by the need for high-temperature annealing as well as the need for different process flows for thin and thick waveguides. New techniques are needed to maintain the state-of-the-art losses, nonlinear properties, and CMOS-compatible processes while enabling this next generation of 3D silicon nitride integration. We report a significant advance in silicon nitride integrated photonics, demonstrating the lowest losses to date for an anneal-free process at a maximum temperature 250 °C, with the same deuterated silane based fabrication flow, for nitride and oxide, for an order of magnitude range in nitride thickness without requiring stress mitigation or polishing. We report record low anneal-free losses for both nitride core and oxide cladding, enabling 1.77 dB m

Identifiers

PMID38977674
PMCPMC11231177

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.