ArticleNature communications2024
The role of microstructure in the thermal fatigue of solder joints.
Article in Nature communications, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 12 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
12 citing papers in PubMed.
- Editorial for Special Issue "High-Reliability Semiconductor Devices and Integrated Circuits, 3rd Edition".Micromachines · 2026Article
- Non-destructive orientation tracking of individual β-Sn grains in die-attach solder joints.Journal of synchrotron radiation · 2026Article
- Image-to-molecule benchmarking dataset with fractal pattern and hierarchical morphology recognition.Scientific data · 2026Article
- Failure Behavior and Mechanism of Solder Joint Under Thermal Mechanical Coupling Loads.Materials (Basel, Switzerland) · 2026Article
- Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints.Journal of materials science · 2026Article
- Sample preparation induced artefacts in soft SAC solders from uncooled and cooled Argon ion milling.Scientific reports · 2025Article
- Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits.Materials (Basel, Switzerland) · 2025Article
- Unravelling CuScientific reports · 2025Article
- In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy.Materials (Basel, Switzerland) · 2025Article
- Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling.Journal of materials science. Materials in electronics · 2025Article
- Effects of Ag and melt undercooling on the microstructure of Sn-Ag solder balls.Journal of materials science. Materials in electronics · 2025Article
- Effective preparation of low-melting solder materials for atom probe tomography.Scientific reports · 2024Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
6 authors.
Funding
Abstract
Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid array (BGA) package using EBSD mapping of localised subgrains, recrystallisation and heavily coarsened Ag
Identifiers
What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.