ReviewACS omega2024
Electroplated Copper Additives for Advanced Packaging: A Review.
Review in ACS omega, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 7 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
7 citing papers in PubMed.
- Porous Ultralow-κ spAdvanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026Article
- Novel Triazine Derivatives Efficiently Regulate the Interfacial Behavior of Metallic Zinc in Sulfuric Acid Electrolyte.Chemphyschem : a European journal of chemical physics and physical chemistry · 2026Article
- Role of Selected Organic Additives in Sulfate-Based Electroplating Baths for Copper Electrodeposition Toward Additive Manufacturing.Molecules (Basel, Switzerland) · 2026Article
- Structure-Property Relationship in Ultra-Thin Copper Foils: From Nanotwinned to Fine-Grained Microstructures.Materials (Basel, Switzerland) · 2025Article
- Influence of Film Thickness on the Structure and Properties of Copper Thin Films Deposited on BaTiOMaterials (Basel, Switzerland) · 2025Article
- Superconformal Electrodeposition of Cobalt into Micron-Scale Trench with Alkynol Derivatives.Materials (Basel, Switzerland) · 2025Article
- Improved Voltammetric Procedure for Chloride Determination in Highly Acidic Media.Materials (Basel, Switzerland) · 2024Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
7 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
Acid copper electroplating stands as a core technology in advanced packaging processes, facilitating the realization of metal interconnects, bumps, vias, and substrate wiring between transistors. The deposition quality of copper interconnect materials has a crucial impact on the final performance of chips, directly influencing their yield, reliability, and stability. In this intricate process, additives play a pivotal role in regulating the deposition quality and behavior of metal copper. This mini-review comprehensively summarizes the recent research progress in the field of electroplating copper additives for advanced packaging, both domestically and internationally, delving into the types and mechanisms of various additive molecules, including accelerators, inhibitors, and leveling agents. Through in-depth research on these additives, we gain a profound understanding of their specific roles in the electroplating process and the intricate interaction mechanisms among them, providing theoretical support for optimizing the electroplating process. Furthermore, this mini-review also delves into a thorough analysis of the current issues and challenges facing acid copper electroplating, exploring the key factors that constrain the further development of electroplating copper technology. Based on this analysis, we propose several potential solutions and research directions, offering crucial references for the development and application of electroplating copper additives in advanced packaging. In conclusion, this mini-review aims to provide a comprehensive perspective and profound understanding of the development and application of electroplating copper additives through a review and analysis of recent research progress, ultimately aiming to promote the further advancement of advanced packaging technology.
Identifiers
What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.