ArticleMaterials (Basel, Switzerland)2024
Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire.
Article in Materials (Basel, Switzerland), 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
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Who cites it
2 citing papers in PubMed.
- Machine Learning-Based Soft Sensor for Real-Time Wire Bow Prediction in Diamond Multi-Wire Sawing.Sensors (Basel, Switzerland) · 2026Article
- Study on the Motion Trajectory of Abrasives and Surface Improvement Mechanism in Ultrasonic-Assisted Diamond Wire Sawing Monocrystalline Silicon.Micromachines · 2025Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
6 authors.
Funding
Abstract
Electroplated diamond wire sawing is widely used as a processing method to cut hard and brittle difficult-to-machine materials. Currently, obtaining the sawing capability of diamond wire saw through the wire bow is still difficult. In this paper, a method for calculating the sawing capability of diamond wire saw in real-time based on the wire bow is proposed. The influence of the renewed length per round trip, crystal orientation of sapphire, wire speed, and feed rate on the wire sawing capability has been revealed via slicing experiments. The results indicate that renewing the diamond wire saw, and reducing the wire speed and feed rate can delay the reduction in sawing capability. Furthermore, controlling the value of renewed length per round trip can make the diamond wire saw enter a stable cutting state, in which the capability of the wire saw no longer decreases. The sawing capability of diamond wire saw cutting in the A-plane of the sapphire is smaller than that of the C-plane, and a suitable feed rate or wire speed within the range of sawing parameters studied in this study can avoid a rapid decrease in the sawing capability of the wire saw during the cutting process. The knowledge obtained in this study provides a theoretical basis for monitoring the performance of the wire saw, and guidance for the wire cutting process in semiconductor manufacturing. In the future, it may even be possible to provide real-time performance parameters of diamond wire saw for the digital twin model of wire sawing.
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Registered trials
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