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ArticleSmall methods2024

Cobalt-Ion Superhygroscopic Hydrogels Serve as Chip Heat Sinks Achieving a 5 °C Temperature Reduction via Evaporative Cooling.

Mufeng Xi et al.PubMed ↗Full text ↗Publisher ↗

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2 papers cite it

2024
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2026
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Full record →Abstract, authors, funding and every citing paper · PMID 38634244