Evidence map›Paper›PMID 38633494›Full record

ReviewRSC advances2024

Progress of research on the bonding-strength improvement of two-layer adhesive-free flexible copper-clad laminates.

Wanqi Tang, Yuxi Liu, Xianghai Jing, Jinsong Hou, Qianfeng Zhang, Chongguang Jian

Abstract readReview
In one paragraph

Review in RSC advances, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

6 authors.

Wanqi TangInstitute of Molecular Engineering and Applied Chemistry, Anhui University of Technology Ma'anshan 243002 China.
Yuxi LiuCollege of Materials and Chemical Engineering, Chuzhou University Chuzhou 239000 China liuyuxiemail@126.com.ORCID https://orcid.org/0000-0001-8030-1871
Xianghai JingCollege of Materials and Chemical Engineering, Chuzhou University Chuzhou 239000 China liuyuxiemail@126.com.
Jinsong HouCollege of Materials and Chemical Engineering, Chuzhou University Chuzhou 239000 China liuyuxiemail@126.com.
Qianfeng ZhangInstitute of Molecular Engineering and Applied Chemistry, Anhui University of Technology Ma'anshan 243002 China.
Chongguang JianChuzhou HKC Optoelectronics Co., Ltd Chuzhou 239000 China.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

The arrival of the 5G era has placed high demands on the electronic products. Developing thin, light, and portable electronic products capable of simultaneously improving the transmission rate and reducing the signal delay and transmission loss is necessary to meet such demands. The traditional three-layer, adhesive, flexible copper-clad laminate (3L-FCCL) cannot satisfy these demands because of its adhesive component. The large thickness and poor heat resistance disadvantages of 3L-FCCL can be avoided with a two-layer, adhesive-free, flexible copper-clad laminate (2L-FCCL). However, 2L-FCCL has low bonding strength. This work introduces the selection of conductor materials and insulating base films for flexible copper-clad laminates. Modification studies aimed at increasing the bonding performance of 2L-FCCL are summarized based on three aspects. These modification techniques include the surface treatment of copper foils, modification and surface treatment of polyimide films, and surface treatment of liquid-crystal polymers. Prospects are further provided.

Identifiers

PMID38633494
PMCPMC11022041

What OpenQuestion holds

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LicenceCC BY-NC
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Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.