Evidence map›Paper›PMID 38611188›Full record

ArticlePolymers2024

Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model.

Lin Yang, Anxin Ding, Mi Xu, Yuefang Li, Xianhang Zhao, Jingxuan Peng, Xiang Li

Abstract read
In one paragraph

Article in Polymers, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

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3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

7 authors.

Lin YangSchool of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China.
Anxin DingSchool of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China.
Mi XuSchool of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China.
Yuefang LiInstitute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621999, China.
Xianhang ZhaoInstitute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621999, China.
Jingxuan PengSchool of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China.
Xiang LiInstitute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621999, China.

Funding

National Natural Science Foundation of China 11902231
6 · The paper itself

Abstract

To describe the evolution of residual stresses in epoxy resin during the curing process, a more detailed characterization of its viscoelastic properties is necessary. In this study, we have devised a simplified apparatus for assessing the viscoelastic properties of epoxy resin. This apparatus employs a confining cylinder to restrict the circumferential and radial deformations of the material. Following the application of load by the testing machine, the epoxy resin sample gradually reduces the gap between its surface and the inner wall of the confining cylinder, ultimately achieving full contact and establishing a continuous interface. By recording the circumferential stress-strain on the outer surface of the confining cylinder, we can deduce the variations in material bulk and shear moduli with time. This characterization spans eight temperature points surrounding the glass transition temperature, revealing the bulk and shear relaxation moduli of the epoxy resin. Throughout the experiments, the epoxy resin's viscoelastic response demonstrated a pronounced time-temperature dependency. Below the glass transition temperature, the stress relaxation response progressively accelerated with increasing temperature, while beyond the glass transition temperature, the stress relaxation time underwent a substantial reduction. By applying the time-temperature superposition principle, it is possible to construct the relaxation master curves for the bulk and shear moduli of the epoxy resin. By fitting the data, we can obtain expressions for the constitutive model describing the viscoelastic behavior of the epoxy resin. In order to validate the reliability of the test results, a uniaxial tensile relaxation test was conducted on the epoxy resin casting body. The results show good agreement between the obtained uniaxial relaxation modulus curves and those derived from the bulk and shear relaxation modulus equations, confirming the validity of both the device design and the testing methodology.

Indexed as

bulk modulusepoxy resinresidual stressshear modulusviscoelastic properties

Identifiers

PMID38611188
PMCPMC11013115

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.