ArticleHeliyon2024
Introduction to subpressure-driven soft deformation method for removing inherent voids in green components manufactured by material extrusion.
Article in Heliyon, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Who cites it
1 citing paper in PubMed.
- All-Atomic Computational Perspectives for Understanding Morphable Electric Double Layers: A Review.Small (Weinheim an der Bergstrasse, Germany) · 2025Review
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Authors and funding
7 authors.
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Abstract
This study introduces a post-treatment process, the subpressure-driven soft deformation method, to reduce inherent voids in Material Extrusion (MEX) components. By subjecting printed green components to heat treatment under subpressure, the process enhances viscosity, effectively filling voids formed between deposited tracks. The average porosities of the samples sintered from the green components without and with soft deformation are calculated to be 3.55% and 2.36%, respectively. A comparison of the tensile strengths and fracture surfaces of the sintered samples with and without soft deformation treatment indicated that the sintered samples with soft deformation treatment exhibited narrower standard deviation for the various mechanical properties. Capillary rheometer calculations indicate feedstock viscosity to be between 450.34 and 1018.31 Pa s under subpressure, diminishing inter-track voids without sizeable dimensional changes. Molecular dynamics simulation demonstrates a 3.7-fold increase in bond strength, indicating intertrack voids effectively eliminated. Reduced inter-particle distances facilitate necking, grain growth, and improved sintered density.
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